Solutions for Telecommunication OEM's.
The success of the Mobile Telephone has increase pressure on designers and manufacturers to bring new products to market in record time. Imtech's Moldflow service can help ensure processing success and efficiency of your next project.
Imtech have analysed many different telephone and related components including mobile phone cases and chassis parts, base units, handsets, network cases, cable ends, connectors and fibre optic junction boxes.
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Mobile phone handsets have evolved over recent years and typically now are made up of a plastic / metal composite chassis supporting complex electronics, keyboard, battery and ultra thin outside skin mouldings. Aesthetics and quality are a key to success mobile phones and other related consumer goods. Typical problems include: - high fill pressure, short shots, weld lines, gas traps, high gate shear and distortion.
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Our simulation tool kit includes
Moldflow
MPi
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mould filling, cooling, holding phase, part warpage and shrinkage analysis. Gas injection, fibre orientation and core shift options are also available. A simulation highlights most quality problems including: - high fill pressure, short shots, weld lines, gas traps, high gate shear, poor cooling, long cycle times and distortion.
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Capability:
- Fill time
- Injection pressure
- Pressure at transfer
- Melt-front temperature
- Bulk temperature
- Weld lines
- Air traps
- Shear rate / Shear stress
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- Volumetric shrinkage
- Pressures
- Temperatures
- Velocity
- Freeze times
- Accurate clamp force prediction
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- Cavity surface temperature distribution
- Distribution of temperature differences across opposite surfaces of the cavity
- Distribution of average plastic temperature at ejection time
- Distribution of maximum plastic temperature at ejection time
- Relative position of the peak temperature at ejection time
- Distribution of frozen layer thickness
- Temperature profile through thickness for each cavity element
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- Surface temperature distribution on both sides of inserts and
parting planes
- Distribution of temperature difference across insert and joint line surfaces
- Temperature of mold external surfaces and surface of cooling circuits
- Pressure drop along each cooling circuit
- Variation in coolant temperature through each cooling circuit
- Flow rate in each cooling circuit
- Reynolds number in each cooling circuit
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-Total deformation
-Deflection in the X-, Y-, and Z-directions
-Deflection history at any node
-Deflected component shape with exaggeration factor
-Buckling mode shape
-Elemental parallel and perpendicular shrinkage
-Elemental principal residual stress
-Elemental Mises-Hencky stresses
-Elemental maximum shear stress
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